Chip resistor

When electroplating miniaturized passive components, serious issues must be addressed—the agglomeration and the sticking of parts (using steel balls to avoid) during the electroplating process, as well as skip plating due to excessive foam in centrifugal plating. The rates of sticking and skip plating are related to the size and shape of the workpieces. Smaller and flatter workpieces have higher rates of sticking and skip plating, leading to decreased product quality and a reduced range of applications. The low-foaming neutral pure tin process influences the coordination of tin ions in a near-neutral plating solution, thereby resolving the sticking issue of small workpieces. Furthermore, the low-foaming formulation is specifically designed for barrel plating applications of small-sized workpieces, enabling the achievement of smooth and uniform semi-bright pure tin coatings over a very wide current density range.

Multi-layer Capacitor

Designed for effectively inhibiting diffusion in plating ferrite materials (inductors, magnetic cores) without damaging the materials

Wafer inductor

Room temperature nickel plating RT-Ni is a low-nickel process system specifically designed for barrel plating. In addition to operating at higher current densities, it can achieve plating layers with excellent solderability at room temperature, and the plating solution is easy to manage.